Reflow Profile
Reflow Profile
Since reflow profiles depend heavily upon the size of the board and other components, you must perform
additional fine tuning from the general profile shown in Figure 13 .
250
200
Maximum Package Body
Temperature = 220?C (±5?C)
180?C
220?C:
30 Seconds Maximum
150
125
?C
to 1
80
?C
1?C to 3?C
Per Second
1?C to 4?C
Per Second
100
50
120 Seconds
Minimum
Keep Temperature
Above 183?C
(Solder Melting Point)
For at Least 60 Seconds
0
50
100
150
200
250
300
1?C to 3?C
Per Second
Time (Seconds)
Figure 13 ? Sample Temperature Profile for Infrared (IR) or Convection Reflow
CCGA to FBGA Adapter Pin Mapping List
The CCGA to FBGA adapter is routed from the FBGA package to match the existing die pad available to
the CCGA device being prototyped ( Table 2 on page 10 ).
Prototyped Product, Adapter, and PCB Design Matrix
Designing the PCB for a specific product requires an understanding of which adapter socket will work.
Each adapter socket is routed differently, depending on the commercial Axcelerator FG package used for
prototyping and the Axcelerator device or RadTolerant equivalent derivative being prototyped. Table 3 on
page 10 shows the combinations that will work.
9
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